Industries / Electronics
Electronics
Precision coatings for electrical and thermal performance.
Engineered surfaces for electrical insulation, thermal management, wear resistance and contamination control in electronics and semiconductor production.
Components and protection zones
Ceramic-insulated housings and bases
Electrical isolation of conductive substrates and protection against leakage and arcing.
- Zones:
- Housing and base surfaces requiring dielectric protection.
- Coatings / bond coat:
- Al2O3, Al2O3-TiO2; bond coat, if required
- Substrate:
- Aluminium, aluminium alloys and stainless steel.
Heat spreaders
High thermal conductivity and temperature uniformity with oxidation protection.
- Zones:
- Heat-transfer surfaces, contact areas and cooling channels.
- Coatings / bond coat:
- Cu, Ni; Ni / NiCr (bond coat, if required)
- Substrate:
- Copper, aluminium, molybdenum, tungsten and BeCu.
Shielding enclosures and EMI covers
Electromagnetic shielding, corrosion protection and grounding continuity.
- Zones:
- Housing interiors, covers and electrical contact interfaces.
- Coatings / bond coat:
- Ni, Ni-P, Ag; Ni (bond coat, if required)
- Substrate:
- Aluminium, magnesium and stainless steel.
Contact rollers and precision shafts
Low friction, wear resistance and dimensional stability.
- Zones:
- Working diameters, journals and sliding surfaces.
- Coatings / bond coat:
- Cr2O3, DLC; Cr / CrN (bond coat, if required)
- Substrate:
- Tool and stainless steels.
Semiconductor process fixtures
Chemically inert, low-particle surfaces for stable production.
- Zones:
- Supports, rings and process-contact surfaces.
- Coatings / bond coat:
- Al2O3, SiC; bond coat, if required
- Substrate:
- SiC, Si3N4, graphite and quartz.
Sensors and connectors
Stable electrical contact and corrosion protection.
- Zones:
- Contacts, connector surfaces and sensor interfaces.
- Coatings / bond coat:
- Engineered system selected for the service environment
- Substrate:
- Conductive metals and specialised alloys.
Materials and applications
| System | Materials | Application |
|---|---|---|
| Dielectric ceramic | Al2O3, Al2O3-TiO2, SiO2, Si3N4, AlN | Insulating housings, heater supports and wafer carriers. |
| Thermal-management and conductive metallic | Cu, Ni, Ag, NiCu, NiCr; graphite | Heat spreaders, cold plates and thermal interfaces. |
| Barrier and wear-resistant | Cr2O3, Al2O3, SiC, TiN, DLC | Shafts, rollers, seals, fixtures and guide surfaces. |
| EMI shielding | Ni, Ni-P, Cu, Ag; conductive polymers | Enclosures, covers, connectors and shields. |
Coating structure
- Functional layer
- Bond coat, if required
- Component material
Schematic, not to scale. Layer count and bonding mechanism depend on the selected material and process.
Coating processes
- APS
- VPS
- HVOF
- HVAF
- Cold spray (CS)
Typical applications, not a component specification. Composition, thickness, surface preparation and acceptance criteria must be selected for the operating conditions and validated by testing.